With the continuous scaling of device dimensions, the number of cores on a single die is constantly increasing. This integration of hundreds of cores on a single die leads to high power dissipation and thermal issues in modern Integrated Circuits (ICs). This causes problems related to reliability, timing violations and lifetime of electronic devices. Dynamic Thermal Management (DTM) techniques have emerged as potential solutions that mitigate the increasing temperatures on a die. However, considering the scaling of system sizes and the adoption of the Network-on-Chip (NoC) paradigm to serve as the interconnection fabric exacerbates the problem as both cores and NoC elements contribute to the increased heat dissipation on the chip.
Typically, DTM techniques can either be proactive or reactive. Proactive DTM techniques, where the system has the ability to predict the thermal profile of the chip ahead of time are more desirable than reactive DTM techniques where the system utilizes thermal sensors to determine the current temperature of the chip.
Moreover, DTM techniques either address core or NoC level thermal issues separately. Hence, this thesis proposes a combined proactive DTM technique that integrates both core level and NoC level DTM techniques. The combined DTM mechanism includes a dynamic temperature-aware routing approach for the NoC level elements, and includes task reallocation heuristics for the core level elements.
On-chip wireless interconnects recently envisioned to enable energy-efficient data exchange between cores in a multicore chip will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM. Combining the proactive DTM technique with on-chip wireless interconnects, the on-chip temperature is restricted within target temperatures without significantly affecting the performance of the NoC based interconnection fabric of the multicore chip.
Library of Congress Subject Headings
Networks on a chip--Thermal properties; Integrated circuits--Cooling
Computer Engineering (MS)
Department, Program, or Center
Computer Engineering (KGCOE)
Mark A. Indovina
Vasudevan, Niraj, "Combined Dynamic Thermal Management Exploiting Broadcast-Capable Wireless Network-on-Chip Architecture" (2016). Thesis. Rochester Institute of Technology. Accessed from
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