Schottky Field Effect Transistors and Schottky CMOS circuitry
Physical copy available from RIT's Wallace Library at TK7871.95 .V44 2006
It was the primary goal (and result) of the presented work to empirically demonstrate CMOS operation (i.e., inverter transfer characteristics) using metallic/Schottky source/drain MOSFETs (SFETs - Schottky Field Effect Transistors) fabricated on silicon-on-insulator (SOI) substrates - a first-ever in the history of SFET research. Due to its candidacy for present and future CMOS technology, many different research groups have explored different SFET architectures in an effort to maximize performance. In the presented work, an architecture known as a "bulk switching" SFET was fabricated using an implant-to-silicide (ITS) technique, which facilitates a high degree of Schottky barrier lowering and therefore an increase in current injection with minimal process complexity. The different switching mechanism realized with this technique also reduces the ambipolar leakage current that has so often plagued SFETs of more conventional design. In addition, these devices have been utilized in a patent pending approach that may facilitate an increase in circuit density for devices of a given size. In other words, for example, it may be possible to achieve circuit density equivalent to 65 nm technology using a 90 nm process, while at the same time preserving or reducing local interconnect density for enhanced overall system speed. Fabrication details and electrical results will be discussed, as well as some initial modeling efforts toward gaining insight into the details of current injection at the metal-semiconductor (M-S) interface. The challenges faced using the ITS approach at aggressive scales will be discussed, as will the potential advantages and disadvantages of other approaches to SFET technology.