Abstract
Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) and tetrafluoroethylene-coperfluoroalkoxy vinyl ether) (PFA) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified surfaces showed the following: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of the surface; and (4) incorporation of oxygen as CF-O-CF2, CF2-O-CF2 and CF-O-CF3 moieties for FEP and CF-O-CF2, CF2-O-CF2 and CF-O-CnF2n+i moieties for PFA. With long treatment times, cohesive failure of copper sputter-coated onto the modified surface occurred within the modified FEP and PFA and not at the Cu-FEP and Cu-PFA interface.
Library of Congress Subject Headings
Cathode sputtering (Plating process); Polytef; Copper plating; Adhesion; Far ultraviolet radiation; Microwave plasmas
Publication Date
2004
Document Type
Thesis
Student Type
Graduate
Degree Name
Materials Science and Engineering (MS)
Department, Program, or Center
Center for Materials Science and Engineering
Advisor
G. Takacs
Recommended Citation
Dasilva, Wagner, "Adhesion of copper to Teflon® FEP and PFA surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma" (2004). Thesis. Rochester Institute of Technology. Accessed from
https://repository.rit.edu/theses/7531
Campus
RIT – Main Campus
Plan Codes
MSENG-MS
