Abstract
This study examines how direct chip cooling with microchannels can be implemented to regulate the junction temperature of silicon integrated circuits. An optimization is done to identify the channel configuration yielding the minimum pressure drop for a given heat load.
Library of Congress Subject Headings
Heat sinks (Electronics)--Design and construction; Integrated circuits--Cooling
Publication Date
2004
Document Type
Thesis
Student Type
Graduate
Degree Name
Mechanical Engineering (MS)
Department, Program, or Center
Mechanical Engineering (KGCOE)
Advisor
Satish G. Kandlikar
Advisor/Committee Member
Jeffrey D. Kozak
Advisor/Committee Member
Abhijit Mukherjee
Recommended Citation
Upadhye, Harshal R., "Single phase thermohydraulic performance analysis of microchannel flow geometry for direct chip cooling" (2004). Thesis. Rochester Institute of Technology. Accessed from
https://repository.rit.edu/theses/7089
Campus
RIT – Main Campus
COinS
Comments
Physical copy available from RIT's Wallace Library at TK7872.H4 U72 2004