This thesis describes the design of a high-density power distribution system. Properties of impedances of power distribution systems are examined. Impedances are classified as self and trans-impedances. These properties are then used to save simulation time, which is a big factor for power distribution system design. Time domain models are extracted for the test cases. A novel 2D-3D technique of placing decoupling capacitors is demonstrated that is based on the effectiveness of the capacitor at that location. The power distribution system acts as a cavity resonator supporting discrete modes that vary with distance. Each capacitor is placed at the physical location where it has maximum impact on corresponding system modes. Targeting the modes at the ports where they are dominant using decoupling capacitors reduces trans-impedances. This technique is extended to the entire surface of the power distribution system using just a single set of simulations. This thesis presents a novel 2D-3D approach of designing high-density boards having chips with multiple power connections without having to go through lengthy tedious simulations.
Library of Congress Subject Headings
Electric power distribution--Design and construction; Electric power systems--Design and construction
Department, Program, or Center
Electrical Engineering (KGCOE)
Nayak, Ghanshyam, "Power distribution design for high-density packages" (2002). Thesis. Rochester Institute of Technology. Accessed from
RIT – Main Campus