Abstract

Electronic packaging has undergone basic changes in the last few years to keep up with an ever increasing demand for speed and miniaturization. Multichip Modules (MCM) represent a class of advanced packaging technologies. This thesis examines various MCM technologies and their relative advantages and disadvantages. Further, the design process for an MCM is presented in detail. The physical design and simulation for the performance ( electrical and thermal) is also detailed. A design example ties together all the issues that are relevant to the design of an MCM.

Library of Congress Subject Headings

Multichip modules (Microelectronics)--Design and construction; Multichip modules (Microelectronics)--Computer simulation; Microelectronic packaging

Publication Date

1-12-1994

Document Type

Thesis

Department, Program, or Center

Electrical Engineering (KGCOE)

Advisor

Mukund, P

Advisor/Committee Member

Pearson, R

Advisor/Committee Member

Spina, R

Comments

Note: imported from RIT’s Digital Media Library running on DSpace to RIT Scholar Works. Physical copy available through RIT's The Wallace Library at: TK7870.15.N39 1994

Campus

RIT – Main Campus

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