Electronic packaging has undergone basic changes in the last few years to keep up with an ever increasing demand for speed and miniaturization. Multichip Modules (MCM) represent a class of advanced packaging technologies. This thesis examines various MCM technologies and their relative advantages and disadvantages. Further, the design process for an MCM is presented in detail. The physical design and simulation for the performance ( electrical and thermal) is also detailed. A design example ties together all the issues that are relevant to the design of an MCM.
Library of Congress Subject Headings
Multichip modules (Microelectronics)--Design and construction; Multichip modules (Microelectronics)--Computer simulation; Microelectronic packaging
Department, Program, or Center
Electrical Engineering (KGCOE)
Nazareth, Mathew, "Design and simulation of a multichip module" (1994). Thesis. Rochester Institute of Technology. Accessed from
RIT – Main Campus