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Authors

Rahul Sachdev

Publication Date

1996

Document Type

Paper

Abstract

In this study an attempt has been made to investigate the effect of intentional doping of hydrogen near the Si/SiO2 interface by ion implantation. MOS capacitors were fabricated with a composite stacked dielectric of thermally grown SiO2 and LPCVD nitride with and without H-implantation. Poly gate capacitors fabricated on both N and P type silicon wafers showed no significant change with hydrogen implant. Effect of hydrogen was distinct in aluminum gate structures.

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