Publication Date
1990
Document Type
Paper
Abstract
A six step lithographic process has been developed and characterized for Pyralin PI-2703D photosensitive polyimide from DuPont Electronics. The six basic steps are wafer preparation, coating, soft—bake, exposure, development , and cure . The problems encountered in obtaining a suitable immersion development process necessitated the fabrication of a spray development apparatus. The image quality resulting from these different development techniques was compared.
Recommended Citation
Reinisch, William
(1990)
"Development of a Photosensitive Polyimide Process,"
Journal of the Microelectronic Engineering Conference: Vol. 4:
Iss.
1, Article 32.
Available at:
https://repository.rit.edu/ritamec/vol4/iss1/32