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Article Title

Preface to the Special Issue on “1st International Congress on Advances in the Packaging Industry - Product and Process (API 2015)”

Authors

Author #1

Abstract

The 1st International Congress on Advances in the Packaging Industry - Product and Process (API 2015) was held in Naples (Italy) on 19-20 November 2015. It was organized by the Regional Competence Centre for Technologies (CRdC Tecnologie Scarl, www.crdctecnologie.it), the Department of Chemical, Materials and Production Engineering of the University of Naples Federico II (DICMaPI, www.dicmapi.unina.it), the Department of Industrial Engineering of the University of Salerno (DIIn, www.diin.unisa.it), and the Italian Flexible Packaging Association (Gifl ex, www.gifl ex.it)