Location
Rochester Institute of Technology
Start Date
5-2015 12:00 AM
End Date
5-2015 12:00 AM
Description
Abstract—Amorphous carbon may be used as a hard mask alternative to nitride in conjunction with multiple patterning lithography and line-width trimming applications. This work focuses on the simulation and deposition for optical optimization of a carbon hard mask using plasma enhanced chemical vapor deposition (PECVD). By creating a central composite design centered about pressure, power, and gas flow and analyzing the results, it was found that the optical parameters were dependent
primarily on power and chamber pressure while the deposition rate varied with all three parameters. This film can enable sublithographic patterning of lines approaching 100 nm using an i-line (365 nm) stepper.
Amorphous Carbon Hard Mask for Multiple Patterning Lithography
Rochester Institute of Technology
Abstract—Amorphous carbon may be used as a hard mask alternative to nitride in conjunction with multiple patterning lithography and line-width trimming applications. This work focuses on the simulation and deposition for optical optimization of a carbon hard mask using plasma enhanced chemical vapor deposition (PECVD). By creating a central composite design centered about pressure, power, and gas flow and analyzing the results, it was found that the optical parameters were dependent
primarily on power and chamber pressure while the deposition rate varied with all three parameters. This film can enable sublithographic patterning of lines approaching 100 nm using an i-line (365 nm) stepper.