Printed electronics processes have the potential to make electronics manufacturing more ﬂexible by providing a wider choice of materials and easier processing steps. In traditional electronics manufacturing techniques, corrosive etching steps limit the choice of materials and also require advanced infrastructure for process implementation. High speed low cost printing processes (e.g. inkjet) can be used, and the printed tracks can then be cured to conductive circuits that meet the needs of electronic devices like radio frequency identiﬁcation (RFID) tags, sensors, etc.
In this work, intense ﬂashes of broad spectrum light from Xenon lamps are used to cure inkjet printed metal nanoparticle inks. This technique is known as photonic curing. Paper, polyethylene terephthalate (PET), and polyimide have been used as substrates with the aim of determining how diﬀerent substrates aﬀect the behavior of the ink and the photonic curing parameters. A statistical approach was employed for the experiments, and signiﬁcant control variables determining curing of the ink were identiﬁed. Experiments were also conducted to obtain prints conforming to dimensional tolerances.
Using the results from the experiments, standard curing parameters for low resistance and good adhesion of the ink were obtained. The results have been statistically validated and used to study the interaction between the control variables and individual eﬀects of each control variable on the response variable.
Library of Congress Subject Headings
Printed circuits; Printing ink; Curing; Electric conductivity; Semiconductors--Surfaces
Industrial and Systems Engineering (MS)
Department, Program, or Center
Industrial and Systems Engineering (KGCOE)
Poddar, Pritam, "Effect of Substrates in the Resistivity and Adhesion of Copper Nanoparticle Ink" (2016). Thesis. Rochester Institute of Technology. Accessed from
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