The concept of chip package co-design is novel. The chip-package interaction for a low voltage operational transconductance amplifier (OTA) is described in this thesis. The effects on the stability of the OTA were studied when the compensation capacitor is placed in the package instead of on the chip. As the packages have become more sophisticated, it is possible to enhance the operation of the chip-package co-design. A detailed theoretical analysis of the transfer function of the OTA is given. Stability issues like the phase margin and the unity gain bandwidth frequency are discussed. A comparison of the specifications is made between compensation capacitor (Cc) on-chip and Cc on package. The other part of the thesis discusses the effects of power supply noise on the op-amp. As the technology has encouraged the scaling of the feature size more number of functional blocks can be placed on the chip. As a result of this the density of integrated circuits has increased to a great extent. Due to the switching of the digital gates, current distributed in the power distribution planes can cause noise in the power supply of the op-amp. Thus this may lead to unwanted noise in the power distribution system. The effect of the power supply noise on the op-amp is also analyzed in the thesis.
Library of Congress Subject Headings
Electronic packaging--Design; Operational amplifiers
Department, Program, or Center
Electrical Engineering (KGCOE)
Kulkarni, Prachi, "Chip-package co-design of a low voltage operational transconductance amplifier" (2002). Thesis. Rochester Institute of Technology. Accessed from
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