Jerome Wandell

Publication Date


Document Type



The HIT Factory is currently in the development phase for a 6 inch sub-micron CMOS process. The addition of the Canon FPA-2000i1 stepper completes the necessary equipment required to perform a 6 inch photo process at HiT. The major focus of this project is to further the 6 inch photo process development, specifically to setup the exposure process for the first two levels (p-well and active) of the HIT test chip. TV pre-align mark number 2 and auto-align mark 20P-4F were added to all eleven levels of the HIT test chip layout around the originally designed pattern~ area. The revised well and active designs were fabricated on a single mask, along with the Canon FRA marks. Six files were written and linked to the job files F9S3TC_WELL and F983TC_ACT, which can be nm to perform the well and active exposures respectively. Well exposure is complete and tested; however, the active exposure will not align to the well pattern. This is most likely due to an error in the active level job and related data files.

Included in

Engineering Commons