A six step lithographic process has been developed and characterized for Pyralin PI-2703D photosensitive polyimide from DuPont Electronics. The six basic steps are wafer preparation, coating, soft—bake, exposure, development , and cure . The problems encountered in obtaining a suitable immersion development process necessitated the fabrication of a spray development apparatus. The image quality resulting from these different development techniques was compared.
"Development of a Photosensitive Polyimide Process,"
Journal of the Microelectronic Engineering Conference: Vol. 4
, Article 32.
Available at: http://scholarworks.rit.edu/ritamec/vol4/iss1/32