A multilevel metal testchip which analyzes a first level metal, interlevel dielectric, and second level metal has been designed. The test structures will be used to detect opens or shorts in conducting lines, measure via resistance, measure sheet resistance, and determine linewidth or linespace.
Quinn, Matthew D.
Journal of the Microelectronic Engineering Conference: Vol. 4
, Article 31.
Available at: http://scholarworks.rit.edu/ritamec/vol4/iss1/31