High frequencies and sub-micron geometries inherent in today’s millimeter wave integrated circuits mandate utilization of low capacitance cross-over structures such as the air-bridge. A silicon based aluminum air-bridge fabrication process is described. The structure and capacitances associated with these aluminum air-bridges was evaluated for potential use in the fabrication of integrated circuit acoustical disturbance sensors.
Luciani, Antonio L.
"Fabrication of Air-Bridges for Millimeter Wave Integrated Circuits,"
Journal of the Microelectronic Engineering Conference: Vol. 3
, Article 24.
Available at: http://scholarworks.rit.edu/ritamec/vol3/iss1/24