Thermally actuated micromirrors were fabricated to demonstrate a CMOS compatible surface micromachined MEMs process that was developed. A key step in the process was the used of a XeF2 etch to release the structures. A design was created that varied key factors including mirror pad size and number of anchors. For the smallest pads attached by a single anchor, the length and width was varied. The release etch was found to require a sacrificial layer of greater than one micron for fest lateral undercutting. Mirrors with the longest and narrowest necks were found to display the greatest deflection.
Shea, Christopher G.
"Fabrication of Thermally Actuated Micromirror Using CMOS Compatible Surface MEMs Process with XeF2 Release Etch,"
Journal of the Microelectronic Engineering Conference: Vol. 17
, Article 16.
Available at: http://scholarworks.rit.edu/ritamec/vol17/iss1/16