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Authors

Mike Latham

Publication Date

2004

Document Type

Paper

Abstract

Device characteristics are reported on Hf02 gate dielectrics deposited by atomic layer deposition (ALD), and jet vapor deposition (JVD) on strained-Si and bulk Si samples. Capacitance-Voltage (CV) analysis of samples shows comparable interface charge levels between strained-Si and bulk Si samples. A flat band shift of -0.5V was noted between the strained-Si and bulk Si for the JVD samples.

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Engineering Commons

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