A study was done in order to develop a fabrication process for creating air bridges at RIT’s Semiconductor and Microsystems Fabrication Laboratory (SMFL). Process development looked at three key factors (i) a robust lithography process that would produce the necessary rounded profile for fabricating air bridges (ii) sputter deposition vs. evaporation as metal deposition techniques (iii) the strength of the structures by testing the maximum distance an air bridge could span, the minimum and maximum thickness the structure could support, and the dimensions of the support posts. Several samples were fabricated testing the three different factors studied and SEM micrographs of the structures were taken for analysis. A baseline fabrication process was then created for use at RIT’s SMFL.
"Investigation and Development of Air Bridges,"
Journal of the Microelectronic Engineering Conference: Vol. 14
, Article 14.
Available at: http://scholarworks.rit.edu/ritamec/vol14/iss1/14