In this investigation and process development project, a novel method for directly connecting two computer chips together, both electrically and physically was developed. This process utilized several processes and materials that are already used in semiconductor manufacturing and packaging. By using these common materials and processes, it simplifies the implementation of the process, and removes several potential roadblocks. It was found that two chips could successfully be bonded together physically and connected electrically.
Steinfeldt, Jeffrey A.
"Face-to-Face Die Bonding and Direct Interconnects,"
Journal of the Microelectronic Engineering Conference: Vol. 14
, Article 12.
Available at: https://scholarworks.rit.edu/ritamec/vol14/iss1/12