Aluminum pattern definition was evaluated using AZ5214E photoresfst 1n conventional posfttve and image reversal modes. Wet etch and liftoff strategies were examined for each photolithographic process. Defect density as a function of feature size is given for each process. and yield versus area 1s projected. It was determined that image reversal processing yielded a lower defect density than conventional resist processing for both etch and liftoff processes.
Ryan, Michael A.
"Image Reversal with AZ5214E Photoresist for Etch and Liftoff,"
Journal of the Microelectronic Engineering Conference: Vol. 1
, Article 27.
Available at: http://scholarworks.rit.edu/ritamec/vol1/iss1/27