Preliminary work on multi-level metal processes using photosensitive polyimide, Kodak 820 resist. Shipley 1400-27 resist, Pyralin polyimide, spin-on glass and evaporated silicon monoxide was reviewed. The results of this analysis yielded some problem areas which were the foundation for this work. Results from an aluminum/spin-on glass/aluminum process show that spin-on glass is a viable dielectric material and that some work is needed to optimize the process.
Newcomb, Robert M.
"Process Development for a Multi-Level Metal Process,"
Journal of the Microelectronic Engineering Conference: Vol. 1
, Article 24.
Available at: http://scholarworks.rit.edu/ritamec/vol1/iss1/24