Carbon-based electronic nanodevices can be utilized in interfaced, functional three-dimensional complexes that are able to perform computations, memories, information processing and other functions. The density of nanoICs fabricated using nanotechnology by millions of times exceeds the density of most advanced CMOS-based ICs. This paper reports design and analysis of nanoICs with fullerenes that proposed to be utilized as multi-terminal electronic nanodevices. Novel concepts to perform modeling, analysis and design of electronic nanodevices and 3DnanoICs are reported. High-fidelity modeling, heterogeneous simulation and data-intensive analysis are performed addressing 3DnanoICs CAD.

Date of creation, presentation, or exhibit



Copyright 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. ISBN: 0-7803-8536-5Note: imported from RIT’s Digital Media Library running on DSpace to RIT Scholar Works in February 2014.

Document Type

Conference Proceeding

Department, Program, or Center

Microelectronic Engineering (KGCOE)


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