Polyimide (PI), Kapton HN500 (PMDA-ODA), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a little change in surface morphology following treatment. XPS showed an approximate doubling of the atomic O concentration on the modified surface which appeared mostly as the carbonyl moiety. Copper was sputter coated onto the modified PI surface. With long treatment times, cohesive failure occurred within the modified PI and not at the Cu-PI interface. Following cohesive failure, XPS and TOF-SIMS indicated a very thin (<= 10 nm) weak boundary layer of PI adhering to the Cu. The weak boundary layer was removed with a hexane wash.
Date of creation, presentation, or exhibit
Department, Program, or Center
School of Physics and Astronomy (COS)
Sener, U.; Entenberg, Alan; Kahn, Bruce; and Egitto, F., "Adhesion of copper to UV photo-oxidized polyimide (PMDA-ODA) surfaces" (2005). Accessed from
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