Description

Polyimide (PI), Kapton HN500 (PMDA-ODA), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a little change in surface morphology following treatment. XPS showed an approximate doubling of the atomic O concentration on the modified surface which appeared mostly as the carbonyl moiety. Copper was sputter coated onto the modified PI surface. With long treatment times, cohesive failure occurred within the modified PI and not at the Cu-PI interface. Following cohesive failure, XPS and TOF-SIMS indicated a very thin (<= 10 nm) weak boundary layer of PI adhering to the Cu. The weak boundary layer was removed with a hexane wash.

Date of creation, presentation, or exhibit

6-30-2005

Comments

Polyimides And Other High Temperature Polymers: Synthesis, Characterization and Applications 3 (2005) 535-552 3rd International Symposium on Polyimides and Other High Temperature Polymets Orlando, FL, DEC 17, 2003 ISBN: 90-6764-422-6Note: imported from RIT’s Digital Media Library running on DSpace to RIT Scholar Works in February 2014.

Document Type

Conference Proceeding

Department, Program, or Center

School of Physics and Astronomy (COS)

Campus

RIT – Main Campus

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