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This special issue of the “Journal of Applied Packaging Research” collects a selection of papers presented during the “1st International Congress on Advances in the Packaging Industry - Product and Process (API 2015)” held in Naples (Italy) on 19-20 November 2015. The congress was organized by the Regional Competence Centre for Technologies (CRdC Tecnologie Scarl, www.crdctecnologie.it), the Department of Chemical, Materials and Production Engineering of the University of Naples Federico II (DICMaPI, www.dicmapi.unina.it), the Department of Industrial Engineering of the University of Salerno (DIIn, www.diin.unisa.it), and the Italian Flexible Packaging Association (Giflex, www.giflex.it). The aim was at gathering experts from academia and industry to focus on product and process innovations in ﬂexible packaging technology. The 2nd edition of the congress will be held in Italy in 2017 (API 2017).
Di Sarli, Valeria
"Preface to the Special Issue on “1st International Congress on Advances in the Packaging Industry - Product and Process (API 2015)”,"
Journal of Applied Packaging Research: Vol. 8
, Article 1.
Available at: http://scholarworks.rit.edu/japr/vol8/iss1/1