The Journal of Applied Packaging Research is an international forum for the dissemination of research papers, review articles, tutorials and news about the innovation or emerging technologies for the packaging Industry. Journal of Applied Packaging Research.
See the Aims and Scope for a complete coverage of the journal.
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
JAPR’s impact factor now is 0.105
Journal of Applied Packaging Research is published by:
The Rochester Institute of Technology
The Wallace Center
Rochester Institute of Technology
90 Lomb Memorial Drive
Rochester, New York 14623
Current Issue: Volume 9, Number 3 (2017)
Development of Starch-Polyvinyl Alcohol (PVA) Biodegradable Film: Effect of Cross-Linking Agent and Antimicrobials on Film Characteristics
Aniket Satish More, Chandani Sen, and Madhusweta Das
Damping package design using structural corrugated board
Qi Zhang, Katsuhiko Saito, and Katsushige Nagaoka
The Advent of University-Level Packaging Scholarship: The Time, the Place and the People
Diana Twede and Laura Bix
On numerical simulation of the dynamics of bottles in conveyor systems
Niels Hojen Ostergaard and Stephane Danjou
Evaluation of Stability of Unit Loads for Tilt and Shock Events During Distribution
Jay Singh, Koushik Saha, and Tyler Sewell