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The Journal of Applied Packaging Research is an international forum for the dissemination of research papers, review articles, tutorials and news about the innovation or emerging technologies for the packaging Industry. Journal of Applied Packaging Research.

See the Aims and Scope for a complete coverage of the journal.

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This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

JAPR’s impact factor now is 0.105

Journal of Applied Packaging Research is published by:

The Rochester Institute of Technology
The Wallace Center

Rochester Institute of Technology
90 Lomb Memorial Drive
Rochester, New York 14623

Current Issue: Volume 9, Number 3 (2017)

Articles

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Damping package design using structural corrugated board
Qi Zhang, Katsuhiko Saito, and Katsushige Nagaoka

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Morphological, Thermal and Oxygen Barrier Properties Plasticized Film Polylactic Acid
Kurniawan Yuniarto, Bruce A. Welt, Foliatini -, Hanafi -, and Candra Irawan