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The Journal of Applied Packaging Research is an international forum for the dissemination of research papers, review articles, tutorials and news about the innovation or emerging technologies for the packaging Industry. Journal of Applied Packaging Research.

See the Aims and Scope for a complete coverage of the journal.

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This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

JAPR’s impact factor now is 0.105

Journal of Applied Packaging Research is published by:

The Rochester Institute of Technology
The Wallace Center

Rochester Institute of Technology
90 Lomb Memorial Drive
Rochester, New York 14623

Current Issue: Volume 10, Number 1 (2018)

Articles

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Communication and Biodegradable Packaging Relationship: A Paradigm for Final Disposal
Breno Luiz Ottoni, Rafael Mattos Deus, José Alcides Gobbo Junior, Ângela Maria Grossi de Carvalho, and Rosane Aparecida Gomes Battistelle

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Computerized and Electronic Controls in Food Packaging
Anjali Srivastava, Vivek Kumar, and Alak Kumar Singh

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Measuring the Creep Behaviour of Corrugated Board by Cascade and Individual Test Rig
Viktoria Köstner, Jörg B. Ressel, Bernd Sadlowsky, and Péter Böröcz

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Review of Challenges and Advances in Modification of Food Package Headspace Gases
Ziynet Boz, Bruce A. Welt, Jeffrey K. Brecht, William Pelletier, Eric McLamore, Gregory A. Kiker, and Jason E. Butler